Apple is secretly working with multiple foldable iPhones

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 New rumors have spread in the technology product market; Top technology giant Apple at the center of rumors. Rumor has it that iPhone manufacturers are working on multiple prototypes of foldable phones. Apple launched the first iPhone on January 9, 2007. Shortly afterwards, the company took over the position of the world's top smartphone maker. But Apple has never made a foldable smartphone.                  Picture Courtesy: Google Apple is working on a prototype of multiple foldable smartphones - the news came from a reliable data leaker, according to the 9 to 5 Mac. However, due to the complexity of the display technology, it is not clear whether Apple will market commercial versions of the foldable prototypes at all. However, the prototype that is being tested is certain - the leaked claim of the information. Apple is skeptical about whether there will be a demand for foldable phones in the technology market, or whether it will be l...

Intel wants to return to the lost throne by 2025

 Intel has opened its mouth to recent advances in computer chip research. The company hopes that nee research will play a role in building a strong position in the computer chip market over next decade, with its shrinking size and increasing speed.

                Image Credited By: Google

Intel on Saturday unveiled its latest advances in research on computer chips at an international conference in San Francisco, USA. The company has discussed several new technologies for placing different parts of a computer chip on top of each other.

However, Intel's progress is still limited to research articles, the company did not show any prototype.

According to a Reuters report, intel is trying to recover a lost throne by making smaller but faster computer chips. In recent years, Intel has lost its position as the top manufacturer in the market to rival companies such as Taiwan Semiconductor Company (TSMC) and Samsung Electronics.

At the San Francisco conference, Intel chief Pat Gelsinger detailed business plans to return to the market by 2025. However, the research report that the organization has shown to the public, the plan for the next 2025 also matches the idea, according to Reuters.

In order to increase the speed and power of the computer chip, Intel plans to stack the chip 'tile' or 'chiplet' on top of each other in a three-dimensional structure instead of a two-dimensional chip. In the process, the computer chip stacks the tiles, making it possible to connect 10 times more between tiles, Intel said. In other words, it is possible to arrange tiles in more complex structures in this process.

However, according to Reuters, the most advanced of the research reports that Intel showed at the conference included the feature of arranging multiple transistors on top of each other. Consider transistors as a key component of computer chips. These millions of transistors fix the signals 1 and zero of digital logic.

Intel hopes that this process will increase the number of transistors that can be mounted on any part of a computer chip by 30 to 50 percent. In last five decades, the speed of computer chips has increased by increasing the number of transistors.

"We're saving space by putting the components on top of each other, and we're reducing the cost of electricity by reducing the distance to the interconnection. Not only will this reduce costs, it will also increase performance," said Paul Fischer, Intel's director and chief engineer.


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